POSITION SUMMARY

Check automatic or manual die bonding machines that bonds integrated circuit dies to package cavity (pad) orientation. Perform multi tasks in clean room assembly area including not limited to 3rd optical visual inspection.

Level 3:

• Classify 3rd Optical criteria for both commercial. Military, classes A to Q standards
• Dress, lift and separate wires of a complex bonding on a single up to five-tired package or more
• Address and separate wires on a package that has 1000 wires and above
• Operate any wire bonders such as K/S 1472, H&K, ASM, Iccon
• Remove wires and balls of a highly complex bond without damaging the bonding pad
• Visual inspection including 2nd optical and 3rd optical specification.
• Inspect die attach orientation, flip chip and encapsulate and package quality per traveler applicable specification.
• Inspect wire bond orientation, bond placement, wire loop and bond quality.
• Operate a variety of equipment, and tools, including high and low-powered microscopes, with speed and accuracy.
• Follow job traveler instructions with accuracy.
• Identify and report process deviations to supervisor.
• Remove nuggets/bond/ball/wedge/wires/ dressing wire loop, prevent wires shortage.
• Remove excess wires, residue, particle inside the package or on lead frame.
• Flexibility to perform other duties as assigned. 

JOB REQUIREMENTS INCLUDE

 Education: High school diploma or equivalent required. 

 Experience: 

• 6 months in Quality Inspection or micro-electronic Production environment preferred
• Experience in 2nd optical and 3rd optical inspections certified Glass S. Cond. A, Glass B, Cond. B, and Commercial.

Knowledge/Skills:  

• Experience with Die Attach quality and Manual Die Attach epoxy and Eutectic, Manual Dam & Fill.
• Ability to multitask, and meet quality goals, safety requirements, and follow company policies.

***When applying, please note that you saw the job posted on the NOVAworks Job Board. If you need help with your resumé, please see a NOVAworks Career Advisor.